Engineering Success

Our client is a well-established European manufacturing company with a long-standing history dating back more than 140 years. The company is a global leader in the closure lining and packaging industry, specializing in the manufacturing of high-quality sealing liners and inserts for plastic and aluminium caps and closures. With an international presence and a strong customer base across industries including food and beverages, pharmaceuticals, agrochemicals, industrial chemicals, cosmetics, and lubricants, the company is committed to delivering innovative packaging solutions while maintaining high standards of quality, reliability, and customer satisfaction. We are looking for a Quality Management Representative (QMR) to oversee and coordinate quality management activities at the company's manufacturing operations in Rayong. This role will be responsible for maintaining and improving the Quality Management System, ensuring compliance with relevant standards and regulatory requirements, and driving continuous improvement across production and operational processes.

Responsibilities

• Oversee and coordinate all quality-related activities across the organization
• Manage external certification and surveillance audits, including ISO 9001, BRC, and other relevant standards
• Conduct internal and cross-functional audits to ensure compliance with established quality requirements
• Ensure compliance with applicable legal, regulatory, and customer requirements for raw materials and finished products
• Evaluate and qualify raw materials through laboratory testing, trials, and technical reporting
• Oversee laboratory operations, ensuring proper functionality, organization, and maintenance
• Establish standardized laboratory testing procedures and test plans, coordinating technical matters with the international headquarters laboratory
• Manage customer and supplier complaints, including investigation, root cause analysis, and corrective actions
• Identify opportunities for continuous improvement in quality systems, processes, and product standards

Qualifications

• Bachelor's degree or higher in Science, Engineering, or a related technical discipline
• Strong quality-oriented mindset with the ability to take ownership of overall quality performance
• Structured, analytical, and systematic approach to problem-solving and decision-making
• Good understanding of quality management systems and manufacturing processes
• Fluent in both Thai and English, with strong communication and coordination skills
• Experience working with ISO 9001 and BRC standards
• Background in packaging, manufacturing, or related industries
• Hands-on experience with laboratory testing, material qualification, and technical trials
• Experience managing quality audits and handling customer or supplier complaints

Our client is an established semiconductor manufacturer specializing in advanced packaging and assembly technologies. They deliver high-quality manufacturing solutions for the global electronics and semiconductor markets. The Packaging Design Engineering Manager is a hands-on technical leader who owns package design and new product introduction (NPI) across Flip-Chip, Power Packaging, and/or SMT platforms. You will take new products from package concept through design, qualification, and production ramp, working closely with assembly, test, and customers to deliver packages that are manufacturable, reliable, and high-yielding.

Responsibilities

• Hands-on package design for new products, including substrate and layout design, particularly in Flip-Chip, Power Packaging, and/or SMT
• Run design simulations (e.g. thermal, mechanical, electrical) to validate package performance before build
• Define package architecture, materials, and process flows with design-for-manufacturability (DFM) in mind
• Drive NPI activities from design through qualification and production ramp, ensuring new packages meet quality and reliability requirements
• Plan, run, and analyze design and process experiments DOE) to optimize performance, yield, and process stability
• Lead design reviews and technical discussions with customers, and translate their requirements into package specifications
• Partner with assembly and test operations to resolve manufacturing issues and feed lessons back into design
• Identify and implement design and process improvements that raise efficiency and product quality
• Lead, coach, and develop the packaging engineering team while staying close to the technical work

Qualifications

• Bachelor’s degree in Engineering (Electrical, Electronics, Materials, or related field), Science, or equivalent
• Minimum 8 years in semiconductor packaging and manufacturing, with hands-on experience in Flip-Chip, Power Packaging, and/or SMT
• Proven hands-on package design experience (substrate/layout design and simulation tools), plus NPI, DFM, and qualification/reliability testing
• Solid knowledge of semiconductor packaging and assembly processes
• Leadership and team management experience across cross-functional engineering and production teams
• Strong data analysis and statistical skills (DOE, yield analysis, SPC), plus strong reporting ability
• Strong English communication, verbal and written, including comfort presenting to customers